• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to an adhesive coating device for chip bonding, in which an applicator is fastened, the body portion having a coating tube for applying the adhesive injected through one side through the other side; And an applicator body in which an end of the other side of the applicator tube is inserted and fastened to an inner surface, and which has a bottom surface perpendicular to the inner surface, penetrated through the bottom surface thereof, An adhesive applying device for chip bonding comprising an applicator having a plurality of applicators applied to a die pad, wherein the surface is inclined or inclined from the inner surface on which the applicator is inserted and fastened to the bottom surface on which the applicator is formed. By providing an adhesive coating device for bonding the chip to which the connected applicator is fastened, the adhesive does not accumulate on a curved surface or a surface having an inclination, and the applicator cleaning time is shortened because the surface is washed. In addition, the adhesive is concentrated toward the applicator along the inner surface of the applicator, and since the adhesive moves toward the applicators according to the air pressure applied inside the applicator, there is an advantage of inducing uniform application of the adhesive.
    公开号:KR19980044543A
    申请号:KR1019960062636
    申请日:1996-12-06
    公开日:1998-09-05
    发明作者:최강석；송구암；지창환
    申请人:김광호；삼성전자 주식회사；
    IPC主号:
    专利说明:

    Adhesive dotting Apparatus for bonding chip having dotter
    The present invention relates to an adhesive coating device for chip bonding, and more particularly, a portion connecting the inner surface of the applicator and the bottom surface on which the applicators are formed to have a uniform surface or curved surface to uniformly apply the adhesive. The present invention relates to an adhesive coating device for chip bonding in which an applicator is fastened to induce and shorten the cleaning time in an applicator cleaning process.
    The chip bonding process is a dicing process in which a semiconductor chip is separated into individual semiconductor chips in a wafer in which a plurality of circuit elements are formed, and each semiconductor chip which has undergone the cutting process is separated on the wafer. To a die pad portion of the lead frame.
    The adhesive used in the chip bonding process is largely divided into a soft adhesive and a hard adhesive.
    A flexible adhesive refers to an organic adhesive such as lead-based solder and thermally conductive particles filled with epoxy or polyimide.
    The thermal mismatch between the semiconductor chip and the lead frame is primarily absorbed by the adhesive and only a slight thermal stress is transferred to the chip.
    The hard adhesive includes an eutectic adhesive based on gold (Au), for example, AuSi, AuSn, AuGe and the like.
    In the assembly process of the plastic package, an epoxy adhesive (hereinafter referred to as silver-epoxy adhesive) using silver (Ag) having excellent thermal conductivity as a filler is mainly used.
    An adhesive coating device for chip bonding will be described with reference to the drawings.
    1 is a cross-sectional view showing an adhesive coating device for chip bonding to which the applicator according to the prior art is fastened.
    FIG. 2 is an enlarged cross-sectional view illustrating a state in which an adhesive is applied through an applicator of the applicator of FIG. 1.
    1 and 2, the chip adhesive bonding apparatus (10; hereinafter referred to as an adhesive coating device) according to the prior art is a body portion 2 formed with a coating tube (7) for applying the adhesive; The applicator 50 is fastened to one end of the applicator tube 7, and has a plurality of applicators 55 formed thereon to apply the adhesive 30 to the die pad 45 of the lead frame 40. do.
    Then, the tube 20 containing the adhesive 30 is fastened to the distal end of the other side of the coating tube 7.
    Here, when the adhesive 30 is applied to the die pad 45 of the lead frame 40 in the adhesive applying device 10, air pressure is applied to the upper surface of the adhesive 30 contained in the tube 20. Upon operation, the adhesive 30 moves from the tube 20 along the applicator tube 7 of the body part 2 to the top surface of the die pad 45 through the applicator 55 of the applicator 50. It is applied by dotting method.
    1 shows the adhesive 33 applied to the die pad 45.
    And the air pressure acts from top to bottom, so that the adhesive 30 also moves from top to bottom and is applied.
    Here, the applicator 50 will be described in more detail. In the applicator 50, the lower end of the applicator tube 7 is inserted and fastened to the inside of the applicator body 53, and the applicator body 53 is provided. The inner surface 57 and the bottom surface 59 in contact with the inner surface 57 thereof are in vertical contact with each other.
    Then, it has a structure in which a plurality of applicators 55 are formed through the bottom surface 59 of the applicator body.
    In addition, the applicators 55 formed on the bottom surface 59 are positioned to correspond to the lower part of the applicator 7, and are typically applied to a portion of the die pad 45 of the lead frame on which the semiconductor chip is to be mounted. It has a structure formed in the center part of the bottom surface 59.
    Accordingly, the bottom surface 59 may be divided into a portion 58 in which the applicators 55 are formed and a portion 56 outside the applicators 55.
    In the adhesive applying device 10 to which the applicator 50 having such a structure is fastened, air pressure is applied to the upper surface of the adhesive 30 contained in the tube 20 so that the adhesive 30 applies the applicators 55. When applied through, the air pressure also acts on the bottom surface 56 outside the applicators 55.
    However, since the inner surface 57 of the applicator body and the bottom surface 56 outside the applicator are perpendicular to each other, air pressure acts on the inner surface 57 so that the bottom surface 56 and the inner surface 57 contact. The portion of adhesive 30 will remain there without moving.
    Therefore, since the air pressure acting on the bottom surface 56 outside the applicators becomes a lost air pressure which does not help the process of applying the adhesive 30, there is a problem in that it is necessary to control the air pressure to be lost separately. Since control of the air pressure to be lost is difficult, a problem arises in applying a uniform amount of adhesive 30 on the die pad 45 of the lead frame.
    In addition, since the applicators 55 are formed on the bottom surface 58 of the applicator body, and are on the same side as the bottom surface 56 of the outer side of the applicators 55, the bottom surface outside the applicators ( Due to the air pressure acting on 56, the adhesive 30 at that portion does not move all toward the applicators 55 and continues to accumulate to some extent, and the adhesive at the point where the inner surface 57 and the bottom surface 56 contact each other. 35 will remain there without moving.
    The reason is that since the bottom surface 59 has a constant height with respect to the inner surface 57, the potential energy of the adhesive 30 in the bottom surface 59 is constant.
    Thus, the adhesive 30 builds up on the bottom surface 56 rather than moving along the bottom surface 56.
    In particular, the movement of the adhesive 35 toward the contact portion of the inner surface 57 and the bottom surface 56 can be almost ignored.
    In FIG. 2, the boundary at which the portion of the adhesive 30 is not moved is indicated by a dotted line, and the movement of the adhesive 30 according to the air pressure is indicated by an arrow.
    In addition, since the tube containing the adhesive is a consumable product, when the adhesive runs out, the tube containing the new adhesive is replaced.
    In addition to the process of replacing the tube 20, the applicator 50 proceeds to wash the adhesives 30 and 35 remaining inside the applicator body.
    In the process of washing the inside of the applicator 50, the portion where the movement of the adhesive is easy to wash the adhesive, but the inner surface 57 and the bottom surface 56 where there is little movement of the adhesive in the adhesive application process is in contact with each other. Difficulties occur in cleaning the adhesive 35 accumulated in the portion is generated a problem that the cleaning time is long.
    Typically, it takes more time to clean the tangent portion where the cotton is in contact with the cotton than the time to clean the cotton.
    Accordingly, it is an object of the present invention to induce a uniform application of the adhesive, the surface having a constant slope between the inner surface of the applicator body and the bottom surface formed with the applicator can minimize the applicator cleaning process time to a minimum Provided is an adhesive coating device for chip bonding, in which an applicator connected by a curved surface is fastened.
    1 is a cross-sectional view showing an adhesive coating device for chip bonding to which the applicator according to the prior art is fastened.
    FIG. 2 is an enlarged cross-sectional view illustrating a state in which an adhesive is applied through an applicator of the applicator of FIG. 1. FIG.
    Figure 3 is a cross-sectional view showing a chip bonding adhesive coating device is fastened with an applicator having a curved surface formed inside the applicator body according to the present invention.
    Figure 4 is an enlarged cross-sectional view showing a state that the adhesive is applied through the applicator of the applicator having a curved surface formed inside the applicator body of FIG.
    ※ Description of the main parts of the drawings ※
    2, 102: body 7, 107: coating tube
    10, 110: adhesive coating device for chip bonding
    20, 120: tube 30, 130: adhesive
    40, 140: lead frame 45, 145: die pad
    50, 150: Applicator 53, 153: Applicator body
    55, 155: applicator 57, 157: inner side
    59, 159: Floor 154: Surface
    In order to achieve the above object, the body portion formed with a coating tube for applying the adhesive injected through one side through the other side; And an applicator body in which an end of the other side of the applicator tube is inserted and fastened to an inner surface, and which has a bottom surface perpendicular to the inner surface, penetrated through the bottom surface thereof, An adhesive coating device for chip bonding comprising an applicator having a plurality of applicators formed on a die pad, wherein the applicator is curvedly connected from an inner surface on which the applicator is inserted and fastened to a bottom surface on which the applicator is formed. Provided is an adhesive applying device for chip bonding with an applicator fastened.
    Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
    3 is a cross-sectional view showing an adhesive coating device for chip bonding to which an applicator having a curved surface formed inside of an applicator body according to the present invention is fastened.
    4 is an enlarged cross-sectional view illustrating a state in which an adhesive is applied through an applicator of an applicator having a curved surface formed inside the applicator body of FIG. 3.
    Referring to FIGS. 3 and 4, the adhesive applying device 110 to which the applicator according to the present invention is fastened includes a body portion 102 having an applicator tube 107 for applying the adhesive 130, and the applicator tube ( The applicator 150 is fastened to one end of the side 107, and has a plurality of applicators 155 formed thereon to apply the adhesive 130 to the die pad 145 of the lead frame 140.
    The tube 120 containing the adhesive 130 is fastened to the other end of the coating tube 107.
    Here, the process of applying the adhesive 130 to the die pad 145 of the lead frame 140 using the adhesive applying device 110, the upper surface of the adhesive 130 contained in the tube 120 Upon application of pneumatic pressure, the adhesive 130 moves from the tube 120 along the applicator tube 107 of the body portion 102, through the applicators 155 of the applicator 150 to the die pad 145. It is applied to the upper surface by dotting method.
    In FIG. 3, the adhesive 133 applied to the die pad 145 is illustrated.
    Here, the applicator 150 will be described in more detail, and the applicator 150 is fastened by inserting the lower end of the applicator tube 107 into the applicator body 153 and inserting the inner surface of the applicator body ( 157 and the corresponding bottom surface 159 is connected by a curved surface 154, the bottom surface 159 has a predetermined height, and has a structure in which a plurality of applicators 155 are formed.
    Thus, when the adhesive 130 is moved by the air pressure acting on the upper surface of the adhesive 130 contained in the tube 120, from the inner surface 157 of the applicator body to which the coating tube 107 is fastened. It is formed of a curved surface 154 having a radius of curvature to the bottom surface 159 between the applicators 155 proximate to the inner surface 157 so that the adhesive 130 by air pressure is concentrated toward the applicators 155. Have
    Here, the curved surface 154, which is shown as a curve on the drawing, is formed on the outside of the applicators 155 in a symmetrical direction in which the slope is close to zero.
    In addition, the air pressure acting on the curved surface 154 guides the adhesive 130 moved on the curved surface 154 toward the applicators 155, and the curved surface 154 has a height difference. 130 does not accumulate and continues to move downward with the applicators 155.
    Therefore, in the conventional applicator, an element that prevents the flow of the adhesive due to the loss of air pressure applied to the outside of the applicators can be reduced, thereby inducing uniform application of the adhesive 130.
    In addition, in the process of replacing the tube 120 after the exhaustion of the adhesive 130 contained in the tube 120 and the process of cleaning the applicator 150, the inner surface 157 and the bottom of the applicator body Since the surface 159 is connected to the curved surface 154, it is easier to clean than when the inner surface and the bottom surface have a tangential structure as in the prior art.
    Of course, the outer surface of the end of the applicator tube may be connected to the surface having a predetermined slope between the inner surface of the applicator body to which the inner surface of the applicator is fastened, and the inner surface of the applicator body may have a structure that is concentrated toward the applicators.
    The main is connected between the inner surface of the applicator body and the bottom surface of the outer side of the applicators adjacent to the inner surface by a surface structure such as a curved surface or a surface having a constant inclination, thereby preventing the adhesive from accumulating on the connecting portion.
    Thus, according to the structure of the present invention, the inner side of the applicator and the outer side of the applicator on the bottom surface close to the inner side are connected to the surface, whereby the adhesive is along the surface by the air pressure acted on the inner side of the applicator body. Because of the movement, the adhesive does not accumulate on the face, and the applicator cleaning time is shortened because the face is washed.
    In addition, since the loss of air pressure applied to the adhesive is small, the adhesive moves toward the applicators in accordance with the air pressure, so that the uniform application of the adhesive can be induced.
    权利要求:
    Claims (6)
    [1" claim-type="Currently amended] Body portion formed with a coating tube for applying the adhesive injected through one side through the other side; And
    An end of the other side of the applicator tube is inserted and fastened to an inner surface, and is formed through an applicator body having a bottom surface in direct contact with the inner surface, and a bottom surface thereof. In the adhesive agent application device for chip bonding comprising an applicator with a plurality of applicators formed on the pad,
    Adhesive coating device for chip adhesive with a coater, characterized in that connected to the curved surface from the inner surface in which the coating tube is inserted and fastened to the bottom surface formed with the applicator.
    [2" claim-type="Currently amended] The chip bonding adhesive applying device according to claim 1, wherein the portion of the bottom surface on which the applicator is formed has a fixed height.
    [3" claim-type="Currently amended] The applicator according to claim 1 or 2, wherein the curved surface formed inside the applicator body is formed at a portion between an applicator close to the inner surface from an inner surface to which the applicator is fastened. Adhesive coating device for chip bonding.
    [4" claim-type="Currently amended] 2. The apparatus of claim 1, wherein the applicator is connected to a surface having a predetermined slope from an inner surface on which the applicator is inserted and fastened to a bottom surface on which the applicator is formed.
    [5" claim-type="Currently amended] 5. The chip bonding adhesive applying device according to claim 4, wherein the portion of the bottom surface on which the applicator is formed has a constant height.
    [6" claim-type="Currently amended] 6. The surface according to claim 4 or 5, wherein the surface having a constant slope formed inside the applicator body is formed in a portion between the applicator close to the inner surface from the inner surface to which the applicator is fastened. Adhesive coating device for chip bonding with an applicator fastened.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1996-12-06|Application filed by 김광호, 삼성전자 주식회사
    1996-12-06|Priority to KR1019960062636A
    1998-09-05|Publication of KR19980044543A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019960062636A|KR19980044543A|1996-12-06|1996-12-06|Adhesive applicator for chip bonding with applicator|
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